COF (Chip On Film) implementation service
We provide a comprehensive COF assembly service from mass production to small-scale prototyping, including product development, material procurement, assembly, and electrical characteristic testing.
COF stands for Chip On Film, which is a method of mounting that provides both electrical connectivity and mechanical fixation of driver ICs onto a film-like substrate. It is primarily used for the implementation of display driver ICs, allowing for high-precision mounting of ICs on substrates with fine wiring pitches. We possess numerous integrated facilities, including self-developed equipment utilizing a highly productive reel-to-reel method, enabling us to respond to a wide range of customer needs beyond just display applications by leveraging the product features of COF (film bendability, fine wiring pitch compatibility, thin profile compatibility). **Features** - Technology development aimed at mass production of fine wiring pitch products Mass production track record: 22um pitch, prototype track record: 18um pitch - Not only for the mounting of driver ICs but also accommodating a wide range of customer requirements Implementation of multiple ICs, attachment of reinforcement plates, component mounting, hole drilling, individual piece processing, and conducting various reliability tests.
- Company：エスタカヤ電子工業
- Price：Other
